883 research outputs found

    Towards Structural Testing of Superconductor Electronics

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    Many of the semiconductor technologies are already\ud facing limitations while new-generation data and\ud telecommunication systems are implemented. Although in\ud its infancy, superconductor electronics (SCE) is capable of\ud handling some of these high-end tasks. We have started a\ud defect-oriented test methodology for SCE, so that reliable\ud systems can be implemented in this technology. In this\ud paper, the details of the study on the Rapid Single-Flux\ud Quantum (RSFQ) process are presented. We present\ud common defects in the SCE processes and corresponding\ud test methodologies to detect them. The (measurement)\ud results prove that we are able to detect possible random\ud defects for statistical purposes in yield analysis. This\ud paper also presents possible test methodologies for RSFQ\ud circuits based on defect oriented testing (DOT)

    A test chip for automatic reliability measurements of interconnect vias

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    A test circuit for electromigration reliability measurements was designed and tested. The device under test (DUT) is a via-hole chain. The test circuit permits simultaneous measurements of a number of DUTs, and a fatal error of one DUT does not influence the measurement results of the other DUTs. Measurements require only a few measurement instruments. Comparing the measurement results of a single DUT io the measurement results of the test circuit shows that the test circuit may be used for reliability measurements

    The Detection of Defects in a Niobium Tri-layer Process

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    Niobium (Nb) LTS processes are emerging as the technology for future ultra high-speed systems especially in the digital domain. As the number of Josephson Junctions (JJ) per chip has recently increased to around 90000, the quality of the process has to be assured so as to realize these complex circuits. Until now, very little or no information is available in the literature on how to achieve this. In this paper we present an approach and results of a study conducted on an RSFQ process. Measurements and SEM inspection were carried out on sample chips and a list of possible defects has been identified and described in detail. We have also developed test-structures for detection of the top-ranking defects, which will be used for yield analysis and the determination of the probability distribution of faults in the process. A test chip has been designed, based on the results of this study, and certain types of defects were introduced in the design to study the behavior of faulty junctions and interconnections

    Control electronics for a neuro-electronic interface implemented in a gate array

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    Presents a Gate Array for implementing electronic circuitry to control multi-electrode arrays, which consist of 128 microelectrodes. The chip contains multiplexers, current sources and buffer amplifiers in CMOS technolog

    Beroepsprofiel leraar NT2

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    Meningen van leerlingen over intercultureel onderwijs

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    Determining DfT Hardware by VHDL-AMS Fault Simulation for Biological Micro-Electronic Fluidic Arrays

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    The interest of microelectronic fluidic arrays for biomedical applications, like DNA determination, is rapidly increasing. In order to evaluate these systems in terms of required Design-for-Test structures, fault simulations in both fluidic and electronic domains are necessary. VHDL-AMS can be used successfully in this case. This paper shows a highly testable architecture of a DNA Bio-Sensing array, its basic sensing concept, fluidic modeling and sensitivity analysis. The overall VHDL-AMS fault simulation of the system is shown

    Testability issues in superconductor electronics

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    An emerging technology for solutions in high-end applications in computing and telecommunication is superconductor electronics. A system-level study has been carried out to verify the feasibility of DfT in superconductor electronics. In this paper, we present how this can be realized to monitor so-called single-flux quantum pulses. As a part of our research, test structures have been developed to detect structural defects in this technology. We also show detailed test results of those structures. It proves that it is possible to detect possible random defects and provide defect statistics for the Niobium-based fabrication process
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